Mechanical Engineer

We are looking for a highly motivated Mechanical/Thermal Engineer that will mainly be responsible for performing mechanical design on server hardware using Rivos chips and other electronic components. This position will report to the Thermal/Mechanical Engineering Manager. What will you do?

• Responsibilities for this position include but not limited to:
• Mechanical design at the component, board and chassis levels.
• Assembly design including high power ASICs, sockets, heat sinks.
• Mechanical design of air/liquid cooled heat sinks & exchangers/cold plates.
• Closely working with board designers to determine dimensions, keep out zones, translate ECAD into MCAD and prepare board layouts.
• Collaborating with the other engineering teams (Reliability, SI/PI, Power, General HW) and making necessary changes on mechanical design.
• Following the OCP guidelines, understanding the revisions/updates, attending appropriate OCP meetings and applying them to mechanical design of Rivos chassis.
• Design of cables and bundling through Rivos chassis at various form factors.
• Running FEA analysis at board and chassis levels to ensure Mechanical Integrity.
• Generating and maintaining BOM.
• Working with CM, OEM and ODMs to develop mockups, test samples and high-volume products.

Desired Skills and Experience:

• Team player with good communication and interpersonal skills.
• Passionate about working in a startup environment, exploring, learning new techniques and applying them to product design.
• Must have experience with electro-mechanical design for rack mounted fixed & modular server or networking equipment.
• Must have experience working with CM, OEM and ODMs.
• Experience with board/PCB/PWB mechanical design.
• Experience with cabling/bundling in electronic enclosures.
• Experience with various fabrication processes including sheet metal, injection molding, soft and hard tooling.
• Familiarity with OCP mechanical design guidelines and design of Colo boxes.
• Experience with air & liquid cooling systems.
• Experience with tolerance analysis and ASME Y14.5 GD&T guidelines.
• Expert MCAD and PDM user (NX & Solidworks preferred).
• Experience with IDF and ECAD-MCAD transfer process.
• Ability of working on mock up design and preparing test setups and procedures for mechanical and thermal testing.
• Experience with design and manufacturing of fixtures for experiments, components for prototypes, etc.
• Good knowledge/use of MS or Google Office Suite.
• Implementing test plans: setting up and conducting tests or experiments with attention to detail.
• Good troubleshooting skills with mechanical/thermal design and testing.

Optional Skills:

• Familiarity with ANSYS Mechanical.
• Familiarity with Thermal Design Software, i.e. Ansys IcePak, is a big plus.
• Familiarity with airflow and/or wind tunnel measurements.

Education and Experience

• Minimum education: B.S. degree in Mechanical/Thermal Engineering, Applied Mechanics or Science (Physics).
• Minimum 8 years of experience in a product development and/or qualification environment, preferably in electronics/semiconductor industry.