Optimizing processes and equipment to reduce cost, process variability, and improve process capability. Collaborating with Equipment teams, Process Development and Process Integration to develop innovative new solutions. Enabling automation and data systems to enhance data understanding for faster process development. Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive development projects with vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation products. Maintaining a technology development pilot manufacturing line. Support process and equipment transfer to production facilities (some international travel may be required). Knowledge of Advanced Package Integration and DRAM, NAND or other memory. Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Strong analytical and creative problem-solving skills. Ability to resolve complex issues through root-cause or model-based problem solving. Proficiency in statistics, preferably in statistical process control. Ability to work independently, with minimal direction, and a focus on meeting commitments. Ability to manage projects to ensure deliverables are completed on time and on budget. Ability to multi-task and manage numerous projects simultaneously. Hands on experience with semiconductor processing. B.S. + 3yrs experience or M.S. + 1yr experience or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields. Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions.
Job ID: 483797324
Originally Posted on: 7/2/2025