Sr Mechanical Engineer - Electronics Packaging

By bringing together people that use their passion for purposeful innovation, at Lockheed Martin we keep people safe and solve the world's most complex challenges. Our people are some of the greatest minds in the industry and truly make Lockheed Martin a great place to work. With our employees as our priority, we provide diverse career opportunities designed to propel development and boost agility. Our flexible schedules, competitive pay, and comprehensive benefits enable our employees to live a healthy, fulfilling life at and outside of work. At Lockheed Martin, we place an emphasis on empowering our employees by fostering innovation, integrity, and exemplifying the epitome of corporate responsibility.

Your Mission is Ours.

Lockheed Martin Space is seeking a Senior Mechanical Engineer experienced in electronics packaging.

Roles & Responsibilities:
- 3D CAD (Creo) design and drafting of mechanical/electro-mechanical components and assemblies with a focus on design for reliability, manufacturing, and ruggedization.
- Perform engineering analyses: thermal, structural, tolerance stack-ups.
- Designing and conducting laboratory experiments to evaluate material selections and/or advanced electronic packaging manufacturing processes.
- Collaborate across engineering disciplines to accomplish project tasks/objectives
- Develop engineering qualification plans for requirements and workmanship verification.
- Identify technical risks and develop risk mitigation options with technical project team; Present options/solutions to project management.- Bachelors degree in Mechanical Engineering or Electro-Mechanical Engineering from an ABET accredited University
- 8+ years experience in mechanical packaging of electronic components or systems
- Experienced designing for electronics manufacturing processes (such as SMT, PCB fabrication, polymerics application, applicable solder chemistries, etc.)
- Working knowledge of the electronics product development process
- Basic working knowledge of GD&T
- Experienced working in schedule driven, multi-disciplinary project teams
- US Citizenship and the ability to hold a US government clearance- Active TS/SCI security clearance
- Masters Degree with concentration in Electronics Packaging, Microelectronics, or Electronics Process Development
- Experienced designing for microelectronics manufacturing processes
- Experienced designing for space electronics packaging
- Experienced developing process maps, work instructions, and process documentation