Process Engineer Die to Wafer Hybrid Bonding

Join the Photonics Platforms Business Group within the CTO Office at Applied Materials' Santa Clara headquarters, where you will work with a worldclass research team developing nextgeneration optical interconnects technologies. We are seeking handson Process Engineers to drive dietowafer (D2W) hybrid bonding R D for silicon photonics and copackaged optics applications. This role focuses on hybrid bonding process development, pathfinding, technology derisking, and integration exploration. The engineer will develop and evaluate novel bonding flows enabling photonic-electronic cointegration, a critical enabler for AI and HPC systems. The role provides onthejob training and handson experience with stateoftheart equipment, including the industry's first fully integrated dietowafer hybrid bonding system. Key Responsibilities * Develop dietowafer hybrid bonding processes, including (but not limited to): * Surface preparation and plasma activation * Highaccuracy die placement and alignment * Postbond characterization and process evaluation * Integrate D2W bonding with adjacent process modules such as: * Dicing and die preparation * Die thinning * Interdie gap fill and planarization * Design and execute DOEdriven experiments to understand process limits, sensitivities, and tradeoffs. * Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement. Qualifications * M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline. * Indepth knowledge and handson experience in one or more of the following: * Dietowafer or wafertowafer bonding * Thindie handling and alignmentcritical processes * Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.) * 2.5D/3D integration * Strong understanding of: * Bond interface physics * Alignment and overlay fundamentals * Mechanical behavior of thin and fragile dies * Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP). * Selfstarter with strong problemsolving skills; able to work both independently and collaboratively with minimal supervision. * Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams. ## Qualifications ### Education: Bachelor's Degree ### Skills 3D Integration (Inactive), Wafer Bonding Systems ### Certifications: ### Languages: ### Years of Experience: 7 - 10 Years ### Work Experience: ## Additional Information ### ### Shift: 10-Day 8-Hr (United States of America) ### ### Travel: Yes, 10% of the Time ### ### Relocation Eligible: Yes ### Referral Payment Plan: None U.S. Salary Range: $147,000.00 - $202,500.00 The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.