IC Assembly Engineer (OOJ - 44684)
...00 / US Dollars / Annual Salary
NPAworldwide Recruitment Network
update Last updated: Apr/15/2026
Job Description
Own and develop Die Attach and Flip Chip assembly processes end-to-end
Drive process development, optimization, and yield improvement (~95%)
Work in a high-mix, low-volume environment, managing multiple projects simultaneously
Design and execute DOE (Design of Experiments) for new product introductions (NPI)
Analyze yield issues and implement process improvements on the production line
Collaborate with cross-functional teams (Sales, Ops, Quality, Engineering)
Support RFQs with process inputs and technical feasibility
Train technicians and operators on new processes and quality standards
Contribute to advanced photonics and active alignment assembly (training provided)
Work with or learn advanced tools like die bonders, pick-and-place, alignment systems
Qualifications:
2+ years of hands-on experience in Die Attach and Flip Chip process development
Proven ability to develop and optimize processes with high yield (~95%)
Experience in semiconductor packaging or related micro-assembly (RF, MEMS, etc.)
Strong understanding of DOE, SPC, and yield improvement methodologies
Ability to multi-task in a fast-paced, high-mix environment
Exposure to equipment like ESEC/Evo, Hesse, Amicra, FineTech, Disco, ficonTEC (or similar)
Basic to intermediate exposure to software/tools (SolidWorks, MATLAB, Python, LabVIEW)
ground in optics/photonics is a plus (training will be provided)
Bachelor's degree in Engineering or related field
Why is This a Great Opportunity :
Own and develop Die Attach and Flip Chip assembly processes end-to-end
Drive process development, optimization, and yield improvement (~95%)
Work in a high-mix, low-volume environment, managing multiple projects simultaneously
Design and execute DOE (Design of Experiments) for new product introductions (NPI)
Analyze yield issues and implement process improvements on the production line
Collaborate with cross-functional teams (Sales, Ops, Quality, Engineering)
Support RFQs with process inputs and technical feasibility
Train technicians and operators on new processes and quality standards
Contribute to advanced photonics and active alignment assembly (training provided)
Work with or learn advanced tools like die bonders, pick-and-place, alignment systems
Pay Type:Annual Salary
Pay Rate:...00
Currency Type:US Dollars
Visa sponsorship provided:
No
Location:
San Jose, 95101, CA, California, USA
Remote Status:
No Remote
Pay Type:
Annual Salary
Salary:
...00 / US Dollars
Occupational Categories:
Engineering/ Manufacturing/ Production/ Operations
Industry(ies):
Electronics/ Semi-conductors
...00 / US Dollars / Annual Salary
NPAworldwide Recruitment Network
update Last updated: Apr/15/2026
Job Description
Own and develop Die Attach and Flip Chip assembly processes end-to-end
Drive process development, optimization, and yield improvement (~95%)
Work in a high-mix, low-volume environment, managing multiple projects simultaneously
Design and execute DOE (Design of Experiments) for new product introductions (NPI)
Analyze yield issues and implement process improvements on the production line
Collaborate with cross-functional teams (Sales, Ops, Quality, Engineering)
Support RFQs with process inputs and technical feasibility
Train technicians and operators on new processes and quality standards
Contribute to advanced photonics and active alignment assembly (training provided)
Work with or learn advanced tools like die bonders, pick-and-place, alignment systems
Qualifications:
2+ years of hands-on experience in Die Attach and Flip Chip process development
Proven ability to develop and optimize processes with high yield (~95%)
Experience in semiconductor packaging or related micro-assembly (RF, MEMS, etc.)
Strong understanding of DOE, SPC, and yield improvement methodologies
Ability to multi-task in a fast-paced, high-mix environment
Exposure to equipment like ESEC/Evo, Hesse, Amicra, FineTech, Disco, ficonTEC (or similar)
Basic to intermediate exposure to software/tools (SolidWorks, MATLAB, Python, LabVIEW)
ground in optics/photonics is a plus (training will be provided)
Bachelor's degree in Engineering or related field
Why is This a Great Opportunity :
Own and develop Die Attach and Flip Chip assembly processes end-to-end
Drive process development, optimization, and yield improvement (~95%)
Work in a high-mix, low-volume environment, managing multiple projects simultaneously
Design and execute DOE (Design of Experiments) for new product introductions (NPI)
Analyze yield issues and implement process improvements on the production line
Collaborate with cross-functional teams (Sales, Ops, Quality, Engineering)
Support RFQs with process inputs and technical feasibility
Train technicians and operators on new processes and quality standards
Contribute to advanced photonics and active alignment assembly (training provided)
Work with or learn advanced tools like die bonders, pick-and-place, alignment systems
Pay Type:Annual Salary
Pay Rate:...00
Currency Type:US Dollars
Visa sponsorship provided:
No
Location:
San Jose, 95101, CA, California, USA
Remote Status:
No Remote
Pay Type:
Annual Salary
Salary:
...00 / US Dollars
Occupational Categories:
Engineering/ Manufacturing/ Production/ Operations
Industry(ies):
Electronics/ Semi-conductors
Job ID: 517720428
Originally Posted on: 4/17/2026
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