Electro-Mechanical Engineer

The ideal candidate will bring extensive industrial experience in the design, assembly, integration and testing of spacecraft electronics. The role requires both deep and technical knowledge in the focus areas of Printed Circuit Board, Circuit Card Assembly, Electronics Packaging and Wire and Harness Design and the ability to advise, mentor and engage with senior government stakeholders.

Within IGNITE, you will work in the Severn Operations Manufacturing Team providing support to internal and external customers. We're on a mission to drive innovation and uphold the highest standards of business ethics. We believe that by pushing the boundaries of visionary thinking, we can achieve exceptional results. As a Lockheed Martin employee, you'll have the opportunity to make a meaningful impact while working in an environment that values integrity and excellence.

Key Responsibilities:
Understanding of manufacturing concepts and processes for production applications covering advanced techniques including but not limited to composites fabrication, additive manufacturing, hybrid packaging, automation, inspection, direct part manufacturing, emerging technologies, as well as digital capabilities.
Analyzes, researches, designs and develops materials and their related fabrication and application processes to develop and optimize materials for use in engineering design of and/or application in structures, systems and subsystems.
Applies principles of chemistry, physics, and material behavior to develop metallic, non-metallic and composite material and processing specifications, fabrication and assembly processes.
Provide guidance regarding design concepts, TRL/MRL maturity, and specification requirements to best utilize resources and manufacturing techniques, and ensure processes and procedures are in compliance with regulations
Interface with internal and external customers, program offices, engineering disciplines, and executive management
Collaborate with Design Engineering to provide Design for Excellence (DFX) feedback and identify manufacturing risks early in development
Partner with supply chain and EEE components engineers to establish and enforce a preferred parts list, identify alternate parts, and address part obsolescence
Contribute to design reviews as a subject matter expert in manufacturability, testability, yield improvement, supplier capability, and quality control
Define and document manufacturing and test best practices for designers to adhere to.
Lead manufacturing vendor selection and qualification, define manufacturing readiness requirements, and drive milestone reviews
Direct and coordinate fabrication and manufacturing activities, including managing supplier relations, overseeing quarantine and rework operations, and spearheading continuous improvement initiatives
Investigate non-conformances to identify root causes, develop corrective actions, and drive systemic improvements to designs and manufacturing processes
Identify opportunities to reduce risk, simplify processes, and enhance quality, throughput, and cost. Bachelors degree in Engineering; any relevant certifications are a plus
Experience in PCB fabrication or PCBA assembly manufacturing. Preference for candidates with NPI, spaceflight hardware, and NASA program experience
Expertise in board assembly processes and equipment, such as: stencil/paste print, SPI, pick & place, SMT reflow, AOI, selective solder, X-ray inspection, flying probe, cleaning, coating, and programming
Extensive knowledge of IPC and NASA standards; such as: IPC-A-600/610 Class 3, J-STD-001, IPC-6012, IPC-CC-830, IPC-SM-840, IPC-TM-650, NASA-STD-8739.1. Experience with the IPC space addendum is a plus
Demonstrated experience with materials used in PCBA manufacturing; such as PCB substrates, polymerics (conformal coating, staking, underfill), solder alloys, and electrical components.
Experience developing and supporting PCBA manufacturing processes (ex. SMT, X-ray, ICT, flying probe, DFT)
Knowledge of circuit analysis, test plan development, and troubleshooting of electrical hardware failures
Skilled in failure analysis tools and techniques (SEM, EDX, X-ray, cross-sectioning) and driving root cause investigations
Experience with rigid and flex PCBs for high power and high data rates in high noise environments
Experience with environmental testing requirements and execution
Ability to obtain and maintain a security clearance. Masters degree in Engineering
Experience with electronics packaging, hybrid packaging, and solder joint reliability for Space components
Knowledge of materials and processes used in electronics.
Hands on experience with building, designing and testing electronic assemblies.
Experienced implementing and enforcing Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) principles and leading DFX reviews
Experience with tools such as Solidworks, Altium, SiliconExpert, Valor, and GIDEP.
Knowledge of GD&T and ability to perform tolerance analysis.
Experience collaborating with contract manufacturers and suppliers to improve reliability, lead time, and cost
Ability to lead small teams in root cause investigations and process improvements
Strong interpersonal and collaborative skills with a track record of cross-functional teamwork
Demonstrated ability to work independently, manage priorities, and communicate effectively with internal and external partners
Proposal support, capacity planning, and pricing efforts
Active TS/SCI clearance