You will be the ElectroMechanical Design Engineer for the Missiles&Fire Control (MFC) Electromechanical Engineering organization. Our team delivers the high reliability hardware that powers precision engagement systems for the United States and allied militaries, and we set the technical direction for electromechanical solutions across the MFC portfolio.
What You Will Be Doing
As the ElectroMechanical Design Engineer you will act as the recognized subject matter expert and technical authority, guiding both the hardware architecture and the integrated product teams (IPTs) that bring those designs to life. Your responsibilities will include:
Leading IPTs and serving as the primary technical liaison for customers, ensuring clear communication of requirements, risks, and status.
Architecting, designing, and validating advanced circuit card packages that support ASICs, System on Chip (SoC), and Multi Chip Package (MCP) solutions.
Creating high density circuit cards, cable assemblies, and interconnects that meet stringent size, weight, power, security, and performance constraints.
Developing electromechanical subsystemsprinted wiring boards, harnesses, and sub assembliesfor flagship programs, special initiatives, and IRAD projects.
Conducting thermal, signal integrity, and electromagnetic compatibility analyses to guarantee robust operation in harsh DoD environments.
Driving design assurance reviews, tracking issues, and leading corrective action closure.
Coordinating with systems, hardware, software, test, and supply chain teams to deliver high quality results on schedule and within budget.
Managing risk, schedule, and earned value metrics, and reporting status to senior leadership.
Setting clear technical direction for program engineers based on customer needs and program goals.
Mentoring and developing engineers, fostering an inclusive culture, and championing continuous improvement initiatives.
Preparing and delivering concise technical briefings, risk assessments, and recommendations to internal stakeholders and external customers.
Why Join Us
Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you.
We offer flexible work schedules to comprehensive benefits investing in your future and security, Learn more about Lockheed Martins comprehensive benefits package here.
Further Information About This Opportunity:
This position is in Orlando. Discover more about our Orlando, Florida location.
MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.
Minimum 5 years of professional experience in Electromechanical Engineering or related discipline
Proficient in CREO modeling and electromechanical system design
Proficient with CCA/PWB, cable/harness design and development, and electronic packaging design
Technical or project leadership experience supporting the production of high-reliability electronics products
Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM)
Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customers
Experience working with cross-functional teams across multiple locations
Experience capturing flowed and derived requirements for electromechanical designs
Must be a US Citizen; must possess or be able to obtain a DoD Secret security clearance" Direct experience supporting production (manufacturing and test)
Demonstrated leadership skills and behaviors that align with Full Spectrum Leadership Imperatives
Preparation for and participation in major program design reviews (PDR, CDR)
Experience troubleshooting and resolving technical issues
Proven understanding of electronics standards and processes
Proven understanding of mechanical standards and processes
Proven understanding of electronic packaging principles
Demonstrated ability to multitask and adapt to changing priorities
Experience with Zuken E3 and Windchill
Experience with military defense hardware
Familiarity with SoC/MCP solutions and ASIC verification and validation testing at the circuit card level
Experience with parts and materials selections
Ability to perform design trade studies evaluating cost, weight, packaging, and power benefits
Familiarity with CAMEO
Flex circuit and microelectronics design experience
Active DoD Secret or Top Secret Clearance
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