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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Summary Department Introduction:
Micron Technology, Inc. is a global leader in memory and storage solutions, delivering innovative technology from silicon to systems! The design engineering team develops advanced memory products by combining circuit design, package development, and system-level validation. The team works collaboratively across functions to deliver high-quality, reliable, and cost-effective solutions.
Position Overview:
As a Senior Package Design Engineer, you will design, develop, and optimize advanced semiconductor packages for memory and logic products. You will work with global, cross-functional teams to deliver scalable, high-performance solutions that meet product, manufacturing, and customer requirements.
- Define and optimize package architectures for memory, logic, and analog products.
- Perform parasitic modeling, validation, and design updates to improve performance and reliability.
- Lead package layout activities, including floorplanning, placement, and routing for high-density designs.
- Partner with simulation teams to validate electrical, thermal, and mechanical performance.
- Collaborate with engineering, manufacturing, and product teams to support design for manufacturability.
- Work with internal teams and external partners to address design, assembly, and production challenges.
- Contribute to design standards, tools, and guidelines to improve team efficiency and quality.
- Support development of next-generation packaging solutions for future memory technologies.
- Bachelors degree in Electrical Engineering, Materials Science, or a related field, or equivalent practical experience.
- 5+ years of experience in semiconductor package design, circuit design, or a related area.
- Experience with package layout tools and design processes, including floorplanning and routing.
- Understanding of electrical, thermal, and mechanical behavior in semiconductor packaging.
- Experience working with multi-functional or global engineering teams.
- Masters degree
- Experience with memory technologies such as DRAM or NAND.
- Experience using simulation tools for signal integrity, power integrity, or thermal analysis.
- Familiarity with semiconductor manufacturing and OSAT partners.
- Experience leading projects or influencing technical decisions across teams.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
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