Process Engineer (Hybrid Bonding)

Insight Global is looking for a Process Engineer with a key focus in hybrid bonding to work on site in Austin, TX and support the strategy and introduction of products based on unique and highly differentiated capabilities of a preeminent foundry for semiconductor systems and defense electronics companies. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing technology that will define future roadmaps of semiconductor devices including logic, memory, 3D packaged devices, including thermal management, etc.

Responsibilities:

Running, developing and integrating semiconductor fabrication processes across a wide variety of semiconductor equipment.

This would include running experiments, performing detailed process characterization, performing data analysis, documentation of processes of record, presentation of results, and incorporating feedback from engineers/techs.

Developing processes-of-record and implementing these on product samples for customers.

Assisting with documents such as proposals or reports on costs and inventory levels.

We are a company committed to creating inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity employer that believes everyone matters. Qualified candidates will receive consideration for employment opportunities without regard to race, religion, sex, age, marital status, national origin, sexual orientation, citizenship status, disability, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to Human Resources Request Form ( . The EEOC "Know Your Rights" Poster is available here ( .

To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: .

Skills and Requirements

5 + years of experience as a Process Engineer in the semiconductor industry

Experience with hybrid bonding

Experience with mechanical processes: dicing, bonding, lamination, grinding

Experience working in a fab/ cleanroom environment

Bachelor's degree in materials science, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines. Experience with advanced packaging

Masters degree null

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal employment opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment without regard to race, color, ethnicity, religion,sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military oruniformed service member status, or any other status or characteristic protected by applicable laws, regulations, andordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request to ....